1. TSMC plans to mass-produce 2nm chips in 2025, offering 10-15% performance gains and 25-30% power efficiency improvements; 2. Apple and NVIDIA are confirmed as first customers, with the technology to be used in iPhone 17 Pro and next-gen AI chips; 3. The breakthrough reinforces TSMC's leadership in advanced semiconductor manufacturing amid global competition.
Recent #Mass Production news in the semiconductor industry
1. TSMC announces plans for mass production of 2nm chips in 2025, marking a major advancement in semiconductor miniaturization and energy efficiency; 2. Apple and NVIDIA are confirmed as first major clients, with the technology to be used in next-gen iPhones, AI accelerators, and GPUs; 3. The breakthrough reinforces TSMC's leadership in foundry markets and could reshape global semiconductor competition.
➀ Samsung has established a team to develop 1nm process technology using high-NA EUV machines for mass production in 2029, according to the Seoul Economic Daily.
➁ It is unclear whether Samsung has ordered any of ASML's $350 million high-NA EUV machines.
➂ Samsung denied reports of canceling its 1.4nm process development, admitting project delays and a rumored shift of resources to the 2nm process.
➀ TSMC held a capacity expansion ceremony at its 2nm fab in Kaohsiung to celebrate an early move to mass production.
➁ Mass production at the Kaohsiung fab and another in Hsinchu is expected to start in Q3, with a combined output forecast to generate $60 billion in revenue in Q3 and Q4.
➂ The two fabs have a maximum output of 80k wpm, with yields said to be 'well above' 60-70%. Initial clients include Apple, Nvidia, and Qualcomm.
➀ SK hynix has started mass production of 12-Hi HBM3E memory stacks, setting the stage for next-generation AI and HPC processors; ➁ The new modules offer a peak bandwidth of 1.22 TB/s per module and a total of 9.83 TB/s with eight stacks; ➂ SK hynix is the first company to mass produce 12-Hi HBM3E memory, with plans to ship by the end of the year for AMD's Instinct MI325X and Nvidia's Blackwell Ultra.
➀ GaN is poised to become a crucial technology for power and RF applications in the near future; ➁ Established Si and SiC companies are eager to enter the emerging GaN market; ➂ The transition from innovation to mass production for GaN presents significant challenges.